Canteliver Probe Card
MPI Cantilever Probe Card is widely utilized on gold bump and pad wafer screening for Exhibit driver, logic, and memory machine. MPI’s cantilever probes are classified as the corresponding reply for the needs of fine pitch, small pad dimensions, substantial pace, much less cleansing, multi-DUT, superior pin depend, and ultra-small leakage prerequisites. With remarkable craftsmanship, innovative architecture and tested methodologies based upon mechanical and electrical simulation/measurement final results, earning MPI the very best cantilever provider all over the world.
FCB Probe Card
The FCB Probe Card is among the most experienced engineering of buckling beam probe card. It is aimed to realize the semiconductor ship manufacture time-to-market (TTM) and value of exam (COT) desire. FCB is usually a demonstrated solution for many different semiconductor generation checks from early engineering pilot-operates to superior quantity producing (HVM). FCB is prepared for machine requiring higher signal integrity probing (SI) and/or electric power integrity probing (PI). Apps involve chopping-edge SiPs/SoCs, WLP, graphic processors, micro processor, industrial microcontrollers, and more. FCB assures the world’s very best All round Expense-of-possession (COO) for different DUT purposes.
EVS Probe Card
The EVS Probe Card is really an enhancement above the conventional buckling beam probe card. Vital capabilities are increased existing carrying ability (C.C.C.) and reduce balanced contact power (BCF), in addition to In general MEMS-like attributes. EVS can easily satisfy the need of Innovative wafer probing. Specific alignment and outstanding planarity Command tend to be the important things contributing to stable Make contact with resistance. With its ability and overall performance, EVS Probe Card is a really perfect option for Sophisticated probe cards.
Osprey probe card
The Osprey probe card is MPI’s Resolution to demand from customers for at any time finer pitch. It is actually designed for smaller sized Al pad, and is also ideal for small pitch application with peripheral and total array pattern. With precise alignment and much better planarity Handle, Osprey can get to increased productiveness by multi-DUT layout. The forming wire (FW) form needle manufactured with MPI’s have micro fabrication system not just provides significant-excellent effectiveness but in addition permits simple needle substitution and shortens retaining cycle time.
Kestrel Probe Card
The Kestrel Probe Card is equipped with MEMS wire (MW) needle that is suitable for the need of small power probing. Additionally, it includes a chance to satisfy superior C.C.C. and large pin counts software. The MEMS procedure makes certain extremely reliable needle characteristics, along with the special construction style and design permits specific check here alignment and planarity Manage.
MPI probe card division provides a wide range of solutions to the semiconductor wafer level test market. Integrated Circuit (IC) applications include Drivers, Logic, CIS, RF, Flip Chip and Cu Pillars. MPI’s comprehensive designs, robust manufacturing and state-of-the-art tooling, enables MPI to provide unsurpassed solutions globally for your challenges both today and for many generations to come.
https://www.mpi-corporation.com/probecard/